1. The global market scale continues to expand

  In 2024, the global market size of the plastic packaging machine industry was approximately $1.53 billion. With the rapid development of emerging technologies such as 5G, artificial intelligence, the Internet of Things, automotive electronics, and data centers, the demand for high-performance, miniaturized, and high-reliability semiconductor devices continues to grow, driving the expansion of the plastic packaging machine market. It is expected that the market size will maintain steady growth at a compound annual growth rate (CAGR) in the coming years.

II. Surge in demand in the semiconductor packaging field

   Consumer electronics products such as smartphones and wearable devices have raised higher demands on chip packaging density and performance, driving the demand for advanced packaging. For instance, AI chips, high-performance computing chips, and the like necessitate more intricate packaging processes. As a pivotal equipment, the market demand for plastic packaging machines has consequently escalated. Domestic enterprises like Naike Equipment have swiftly expanded their business by venturing into the semiconductor packaging equipment sector. In 2024, their revenue from semiconductor packaging equipment amounted to 100 million yuan, highlighting the market potential.

III. Diversified expansion of downstream application fields

   In addition to semiconductor packaging, the application of molding machines is continuously expanding in fields such as consumer electronics, automotive electronics, and communication base stations. For instance, the automotive electronics sector demands extremely high reliability for on-board chips, necessitating molding machines to meet packaging requirements in harsh environments like high temperatures and high humidity. The growing demand for high-frequency and high-speed chips in communication base stations is propelling the development of molding machines towards higher precision and efficiency.